microHALL-M300

The ultra-shallow junctions in electronics are becoming thinner and III-V material have entered the manufacturing process. For electronic devices, mobility is everything.

Measurements that used to require days of sample preparation are now performed within minutes using the microHALL-M300 tool.

With the microHALL-M300 tool from CAPRES A/S you no longer have to prepare special coupon size samples with soldered leads to test Hall mobility. You can now measure directly on product wafers or cleaved monitor wafers, you can measure the mobility, the active carrier density and the sheet resistance directly on the samples right after the implant-anneal stage. This will give you crucial feedback and help you speed up your development cycle and cut costs compared to previous techniques.

The microHALL-M300 is a state of the art tool with regard to key process parameters such as high rate of throughput, reliable and reproducible measurements, simple and intuitive user interface, low cost of ownership and high machine uptime secured by easy and efficient productive maintenance procedures.

Beyond this, the semi-automatic microHALL-M300 from CAPRES A/S offers a whole range of unprecedented capabilities and advantages that are truly revolutionary compared yesterday’s Hall Mobility measurement technology. With the following features, unique to semiconductor fabrication, the semi-automatic microHALL-M300 from CAPRES A/S has set the new standard for automatic measurements of Hall mobility and active carrier density in for present and coming technology nodes:

• Accurate and reliable mobility, active carrier density, and sheet resistance measurements on samples from 10 mm to 300 mm wafers
• Micro scale resolution revealing microscopic process artefacts related to advanced chip making
• Non-destructive measurements of thin film samples
• High throughput, maximum machine uptime and sustained process capability through tool life cycle by simple productive maintenance measures

The microHALl-M300 comes with motorized 300 mm X-Y stages ensuring automated full wafer map­ping. Automatic probe landing and autofocus camera are just some of the basic features of the platforms.