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microRSP-A300
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The window of acceptable sheet resistance is shrinking with each technology node resulting in increasingly more rigorous standards for scale and accuracy of metrology tools. The shortcomings of traditional types of 4 point probes are becoming more and more evident. By developing the microRSP, a unique tool for measuring the sheet resistance of conducting films, hereunder Ultra Shallow Junctions (USJ’s), CAPRES A/S has responded to the growing need for reliable sheet resistance measurements on micro scale. The microRSP-A300 makes use of the Micro 4-Point Probe characterised by having a probe pitch of 1000 times smaller pin spacing/pitch than that of conventional probes. This unique feature allows the microRSP to uncover significant thin film characteristics that can be determining factors in relation to the properties and functionality of a thin film- and end products. With the launch of the microRSP-A300, CAPRES A/S has taken the well known and proven 4-point probing technology far into the future of semiconductor production. |
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The microRSP-A300 is a state of the art tool with regards to key production and process parameters such as high rate of throughput, reliable and reproducible measurements, simple and intuitive user interface, low cost of ownership and high machine uptime secured by easy and efficient productive maintenance procedures.
Beyond this, the microRSP-A300 from CAPRES A/S offers a whole range of unprecedented capabilities and advantages that are truly revolutionary compared yesterdays four point probe technology. With the following features, unique to semiconductor fabrication, the microRSP-A300 from CAPRES A/S will undoubtedly set the standard for automatic measurements of sheet resistance in the fabs for present and coming technology nodes:
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- Accurate and reliable surface resistivity measurements of 300 mm (200 mm optional) wafers for advanced chip makers – CAPRES Microscopic Four-Point Probes offers all the benefits of conventional four point probes, but does not penetrate the USJ layer.
- Versatile system – CAPRES Microscopic Four Point Probes can be used to measure the sheet resistance on most conducting thin films used in the semiconductor industry
- Reduction of the number of test wafers - Direct measurement in scribe lines or micro pads on product wafers reduces the need for test wafers in the fab.
- Higher yield through better process monitoring – CAPRES microscopic probes allows for nano scale mapping revealing nano scale in-homogeneities in the ion implant and annealing process.
- High throughput, maximum machine uptime and sustained process capability through tool life cycle by simple productive maintenance measures
- General purpose user interface (SEMI compliant)
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